Natcast's Advanced Packaging Facility

Semiconductor packaging and manufacturing

Semiconductor and analog technology

Materials science and specialty glass

Market research and consulting

A semiconductor manufacturing process that uses hydrogen to deposit thin films of material onto wafers.

A crucial step in semiconductor production that shields fragile chips, enhances connectivity, and boosts performance.

A semiconductor manufacturing process that uses hydrogen and other specialized gases to remove material from wafers with precision.

Arizona

United States

A U.S. government initiative providing $1.4 billion in funding to expand domestic semiconductor manufacturing and advanced packaging capabilities.

A component of CHIPS for America allocating $300 million to industry leaders to develop next-generation substrates and materials for semiconductor packaging.

A collaborative research and scaling facility for semiconductor packaging innovations located in Tempe, Arizona, receiving $1.1 billion in funding.